JPH0358550B2 - - Google Patents

Info

Publication number
JPH0358550B2
JPH0358550B2 JP58243857A JP24385783A JPH0358550B2 JP H0358550 B2 JPH0358550 B2 JP H0358550B2 JP 58243857 A JP58243857 A JP 58243857A JP 24385783 A JP24385783 A JP 24385783A JP H0358550 B2 JPH0358550 B2 JP H0358550B2
Authority
JP
Japan
Prior art keywords
resistor
electrode
hole
substrate
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58243857A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60136391A (ja
Inventor
Minoru Tanaka
Akira Murata
Kazuo Hirota
Fumyuki Kobayashi
Takatsugu Takenaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58243857A priority Critical patent/JPS60136391A/ja
Priority to US06/686,006 priority patent/US4725925A/en
Priority to EP84116410A priority patent/EP0148506B1/en
Priority to DE8484116410T priority patent/DE3475023D1/de
Publication of JPS60136391A publication Critical patent/JPS60136391A/ja
Publication of JPH0358550B2 publication Critical patent/JPH0358550B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Adjustable Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP58243857A 1983-12-26 1983-12-26 回路基板 Granted JPS60136391A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP58243857A JPS60136391A (ja) 1983-12-26 1983-12-26 回路基板
US06/686,006 US4725925A (en) 1983-12-26 1984-12-24 Circuit board
EP84116410A EP0148506B1 (en) 1983-12-26 1984-12-27 Circuit board
DE8484116410T DE3475023D1 (en) 1983-12-26 1984-12-27 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58243857A JPS60136391A (ja) 1983-12-26 1983-12-26 回路基板

Publications (2)

Publication Number Publication Date
JPS60136391A JPS60136391A (ja) 1985-07-19
JPH0358550B2 true JPH0358550B2 (en]) 1991-09-05

Family

ID=17109990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58243857A Granted JPS60136391A (ja) 1983-12-26 1983-12-26 回路基板

Country Status (4)

Country Link
US (1) US4725925A (en])
EP (1) EP0148506B1 (en])
JP (1) JPS60136391A (en])
DE (1) DE3475023D1 (en])

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136391A (ja) * 1983-12-26 1985-07-19 株式会社日立製作所 回路基板
US4777718A (en) * 1986-06-30 1988-10-18 Motorola, Inc. Method of forming and connecting a resistive layer on a pc board
US5136471A (en) * 1987-02-26 1992-08-04 Nec Corporation Laminate wiring board
JPH02117196A (ja) * 1988-10-26 1990-05-01 Canon Inc プリント基板
US5132648A (en) * 1990-06-08 1992-07-21 Rockwell International Corporation Large array MMIC feedthrough
ATE120678T1 (de) * 1990-07-13 1995-04-15 Siemens Ag Keramischer lötbügel.
US5661450A (en) * 1995-11-21 1997-08-26 Sun Microsystems, Inc. Low inductance termination resistor arrays
US6229097B1 (en) * 1996-03-08 2001-05-08 Motorola, Inc. Substrate having trim window in a C5 array
US5990421A (en) * 1997-02-18 1999-11-23 Intel Corporation Built in board resistors
US5994997A (en) * 1997-11-24 1999-11-30 Motorola, Inc. Thick-film resistor having concentric terminals and method therefor
EP1129498B1 (en) * 1998-10-06 2004-08-11 Bourns, Inc. Conductive polymer ptc battery protection device and method of making same
US6230402B1 (en) * 1999-02-17 2001-05-15 Scitex Digital Printing, Inc. Electrical contact termination for a flexible circuit
US20140008104A1 (en) * 2012-02-08 2014-01-09 Panasonic Corporation Resistance-formed substrate and method for manufacturing same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2382024A (en) * 1943-04-24 1945-08-14 Bell Telephone Labor Inc Resistor and method of making it
US2777039A (en) * 1954-06-29 1957-01-08 Standard Coil Prod Co Inc Resistor elements adapted for use in connection with printed circuits
US2994846A (en) * 1960-05-26 1961-08-01 Lockheed Aircraft Corp Structurally integrated film resistor assembly
US3657692A (en) * 1971-03-12 1972-04-18 Markite Corp Trimmer resistor
GB1367983A (en) * 1972-05-25 1974-09-25 Standard Telephones Cables Ltd Electrical circuit elements
DE2936398A1 (de) * 1979-09-08 1981-03-26 Ver Glaswerke Gmbh Elektrisch beheizbare glasscheibe
JPS60136391A (ja) * 1983-12-26 1985-07-19 株式会社日立製作所 回路基板

Also Published As

Publication number Publication date
EP0148506B1 (en) 1988-11-02
EP0148506A3 (en) 1986-04-09
JPS60136391A (ja) 1985-07-19
US4725925A (en) 1988-02-16
DE3475023D1 (en) 1988-12-08
EP0148506A2 (en) 1985-07-17

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term